Resource Library

Gore’s acoustic membrane vents provide consistent high-quality sound, in styles and configurations designed to meet the full range of ingress protection standards, from dust applications to deep immersion applications.

Rapid environmental changes can lead to pressure differentials between inside and outside of an electronic device. GORE^® Pressure Vents provide superb reliability through exceptional balance of airflow and water protection.

A reduced return rate, a secured market position and an improved production process: Learn how a leading brand for TWS earbuds achieved all this with the help of Gore’s venting solutions.

In order to maintain optimal acoustic performance in ever-evolving smartphones, manufacturers need to excel in complexity. Discover how a leading tech company secured their share in the market by mastering this challenge and learn how Gore empowered them to do so.

Learn how Gore developed an innovative solution that provides industry-leading particle protection and acoustic performance to help the world’s largest smartphone OEM and MEMS microphone manufacturers solve a critical predicament.

Learn how Gore Technology helped a well-known manufacturer of conference phones prevent particle contamination, reducing their failure rate from unacceptable levels to nearly zero.

A Case Study on GORE® Acoustic Vents for TWS Earbuds: Learn how Gore Technology helped a renowned OEM of True Wireless Stereo (TWS) earbuds stand out from their competition by providing acoustic performance never before experienced.

Learn how Gore developed a groundbreaking solution that guarantees a high filtration efficiency and acoustic transparency to help China’s largest OEM and their MEMS microphone manufacturers solve a troubling dilemma.

Capturing adventures on an action camera requires the most robust devices. Discover how a renowned brand for panoramic sports cameras redefined durability and learn which part Gore played in the developing process.

GORE® Thermal Insulation has unique properties of low thickness (< 300 μm) with conductivity less than air (< 0.02 W/(m•K) ) and therefore presents challenges in characterization. A test methodology incorporating a modified heat flow method, ex-situ thickness method, and two thickness conductivity calculation is used to provide reliable and accurate thermal conductivity data. Conductivity results show the distribution of data falls below the conductivity specification of 0.02 W/(m•K).

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